Titen™ 224G and PCIe® Gen 7/8 Connectors

HIGH-SPEED, HIGH-DENSITY, SCALABLE BOARD-TO-BOARD & BOARD-TO-CABLE SOLUTIONS

Titen™ is a high-speed connector supporting both mezzanine board-to-board and board-to-cable (BTC) integration. It is designed to deliver superior high-speed performance up to 224 Gb/s PAM 4, targeting PCIe® Gen 7/8 for AI data centers, HPC, and networking systems.

Board-to-Board:
Hermaphroditic Differential Pairs design. The connector is fully shielded for high-speed differential pairs, offering very high density and scalability, with integrated low-power and sideband signal support. Suitable for PCIe® Gen 7 mezzanine applications and hermaphroditic high-speed connector requirements.

• 5 mm, 8 mm, 11 mm stack height options
• Modular design to support scalable differential pairs, sidebands, and power
• Differential pair-to-pair pitch at 2.0 mm, Col to Col pitch at 2.8 mm
• BGA soldering for high-speed differential pairs
• Optimized footprint for easier routing

Board-to-Cable:
Hermaphroditic mezzanine design with robust self-alignment features in the housing. The connector is fully shielded for high-speed differential pairs, offering very high density and scalability, with integrated low-power and sideband signal support. Suitable for PCIe® Gen 7 mezzanine applications and hermaphroditic high-speed connector requirements.

• Mating height reference: 8.90 mm (2-row) | 14.5 mm (4-row) | 18.2 mm (6-row) | 21.9 mm (8-row)