AirBorn Z Series

AirBorn Z Series Compression Interposer Connectors deliver solderless, high-density board-to-board and flex circuit stacking for aerospace, defense, space and rugged industrial applications where reliability is essential. The patented one-piece contact system ensures consistent electrical continuity while rigid bodies and precision guide pins simplify alignment for repeatable, error-free assembly. Proven in extreme vibration, thermal cycling and high-shock environments, AirBorn Z Series connectors save board space, reduce costs and minimize failure points for lasting performance in mission-critical systems.

Features and Benefits

For rugged industrial applications where electrical reliability is crucial, compact and durable connector solutions are a must. Designers require components that provide consistent performance under extreme vibration, high shock and harsh environmental conditions, while also reducing assembly complexity, cost and potential failure points. In these scenarios, flexible connectors are crucial for saving board space, supporting miniaturized layouts and enabling customization for demanding system requirements.

AirBorn Z Series Compression Interposer Connectors deliver high-density, solderless board-to-board and flexible circuit solutions for mission-critical applications. The patented z-axis compression contact system provides reliable electrical continuity while a wiping action maintains low resistance and eliminates foreign object debris, ensuring long-term performance over repeated cycles. With rigid bodies and precision guide pins, installation is simplified and error-free, supporting repeatable, stable alignment in challenging environments.

For applications that require space efficiency and customization, AirBorn Z Series connectors offer designs up to 175 contacts in two- to seven-row configurations with 0.050" (1.27mm) spacing. Selectively loaded contacts, multiple contacts per cavity for redundancy or power, and custom body shapes are also available. These features allow designers to maximize board space, reduce potential failure points and achieve zero outgassing for complex, high-density assemblies in satellites, helicopters, missiles, medical robotics and other mission-critical systems.